Arizona Gigafab Cluster (Fab 21)
Overview
TSMC's US manufacturing site in Phoenix, now backed by a ~$265B commitment — the largest foreign direct investment in US history — after TSMC pledged another ~$100B on its July 16, 2026 earnings call to add at least four more 2nm-and-below fabs. Phase 1 has produced 4nm chips at Taiwan-par yields since Q4 2024 for customers including Apple and Nvidia; Phase 2 brings 3nm production in 2027 (pulled in about a year, equipment move-in from Q3 2026); Phase 3, targeting N2 and A16, has broken ground for ~2029. TSMC expects ~30% of its 2nm-and-below capacity to eventually sit in the US.
Phase 1 in N4 volume production since Q4 2024; Phase 2 (N3) equipment move-in from Q3 2026, production 2027; Phase 3 (N2/A16) targeting ~2029; four more fabs pledged Jul 2026